2022/09/23

How to effectively identify high-quality circuit boards

With the rapid development of mobile phones and electronic communications, the output of PCB circuit boards has been continuously increased, and everyone has higher and higher requirements for the precision, number of layers, and stability of components. Let Runze Wuzhou introduce to you how to effectively distinguish Quality circuit boards?

2022/09/23

Matters needing attention in the production of high-frequency microwave PCB boards

With the continuous development of high-frequency electronic equipment, especially in the increasing development of wireless networks and satellite communications, information products are moving towards high-speed and high-frequency, and communication products are moving towards the standardization of voice, video and data for wireless transmission with large capacity and high speed. Therefore, the new generation of products developed require high-frequency substrates, and the process technology of high-frequency PCB board production is constantly improving to meet the needs of different users. The editor has been engaged in PCB production for more than 10 years, and summarizes the matters encountered in the production process, and briefly describes the matters that should be paid attention to in the production of high-frequency microwave PCB boards.

2022/09/23

What problems are prone to occur in the process of PCB customization

When PCB manufacturers are designing, there are often cases where components that appear to be connected on the plane are actually not connected.

2022/09/23

Quick proofing of pcb board, how to make PCB step by step

The following is a detailed PCB production process: Detailed introduction Process 1. PCBCAD document Process 2. Printing plate making Process 3. PCB inner layer Process 4. Pattern making and inspection Process 5. Lamination Process 6. Punch holes Process 7. Copper chemical precipitation in the hole Process 8.PCB surface layer Process 9. Computer system control and electroplating copper

2022/09/23

What are the uses of PCB aluminum substrates?

Aluminum substrate is a metal copper clad laminate with good heat dissipation, which is the basic material of high-power power electronic circuit structure technology and interconnection technology.

2022/09/23

What is LED PCB? What are the application areas of LED PCB?

LED is the abbreviation of Light Emitting Diode, which is a semiconductor diode. LEDs are soldered to a printed circuit board and come with a chip that produces light through electrical connections.

2022/08/05

AI + quantum computing = quantum memristor?

In recent years, computing has advanced in two main areas: breakthroughs in machine learning, the development of algorithms that automatically improve through experience; and research in quantum computers, the theoretical demonstration that quantum computers are more powerful than any supercomputer.

2022/08/05

High-power infrared led lamp beads to do a good job of heat dissipation

Due to the limitation of semiconductor infrared LED lamp bead body chip technology, the photoelectric conversion efficiency of LED still needs to be improved, especially if the lamp bead with higher power, because its power will be relatively high, about 55% or more of the electric energy will become Thermal energy release (with the development of semiconductor technology, the photoelectric conversion efficiency will gradually improve, which requires customers to do a good job of heat dissipation when using high-power LED products to ensure the normal operation of high-power infrared LED lamp beads.

2022/08/05

The experimental test data tells you what is the difference between incandescent lamps, energy-saving lamps and LED lamps

At present, most of the electricity consumption of our country's residents has been converted into LED lamps, and only a small number of energy-saving lamps are used, and almost no incandescent lamps are used for lighting. But why is this, do you know? Today, I will tell you the reason and the result with data from experimental tests.

2022/08/25

There are many hidden worries behind the domestic replacement of third-generation semiconductors, eager for success, large technology gap, and some projects are unfinished

If you want to know the forefront of silicon-based semiconductors, you need to pay attention to TSMC's 5nm/3nm fab in Taiwan. If you want to know how the current third-generation semiconductor game is progressing, you can turn your attention to the wafer factory of Wolfspeed, the global leader in SiC substrates, located in New York, USA. The substrate material, which is technically difficult and accounts for half of the device cost, is regarded as a key link in the silicon carbide industry chain. There is also a saying in the industry that "whoever has the substrate wins the world".